Devices descending from K001114
47 later devices reach 3M Quik Temp Temporization Material through their predicates, nearest generation first.
| Generation | Number | Device | Applicant | Decided | Own descendants | Recalls |
|---|---|---|---|---|---|---|
| +1 | K033022 | Protemp 3 Garant | 3M Espe AG Dental Products | 2003 | 46 | — |
| +2 | K073296 | TEMPXN28 | 3M Espe AG Dental Products | 2008 | 4 | — |
| +2 | K061530 | MD-Temp | Meta Biomed Co., Ltd. | 2006 | 1 | — |
| +2 | K043043 | Hermes Bond 2 | 3M Espe AG Dental Products | 2005 | 37 | — |
| +2 | K033974 | Hermes Bond | 3M Espe AG Dental Products | 2004 | 0 | — |
| +3 | K202965 | CURA-Temp | Mgnewton, Ltd. | 2022 | 0 | — |
| +3 | K190724 | MD-Temp Plus | Meta Biomed Co., Ltd. | 2019 | 0 | — |
| +3 | K151144 | SuPro 100 | 3M Deutschland GmbH | 2015 | 0 | — |
| +3 | K141562 | MSN-006 | GC America, Inc. | 2014 | 0 | — |
| +3 | K122039 | Kingscross PL-C+B-10, Kingscross PL-C+B-12, Kingscross PL-C+B-08, Kingscross B | Kettenbach GmbH & Co. KG | 2012 | 0 | — |
| +3 | K071131 | UNO | 3M Espe AG Dental Products | 2007 | 35 | — |
| +3 | K071260 | Hermes Bond 3 | 3M Espe AG Dental Products | 2007 | 0 | — |
| +4 | K110302 | Adhesive Exl-759 | 3M Espe AG | 2011 | 34 | — |
| +5 | K252151 | els unibond | Saremco Dental AG | 2025 | 0 | — |
| +5 | K250015 | Ormco™ EtchFree Bonding System, Ormco™ EtchFree Bonding Primer, Ormco™ EtchFree Adhesive | Ormco Corporation | 2025 | 0 | — |
| +5 | K241445 | K-Bond Universal | Spident Co., Ltd. | 2024 | 1 | — |
| +5 | K230009 | EZ Bond Universal | Meta Biomed Co., Ltd. | 2023 | 0 | — |
| +5 | K222581 | Stela Automix System | Sdi Limited | 2022 | 1 | — |
| +5 | K222583 | Stela Capsule System | Sdi Limited | 2022 | 0 | — |
| +5 | K200153 | Bright Bond Universal | Genoss Co., Ltd. | 2020 | 0 | — |
| +5 | K191656 | Zipbond | Sdi Limited | 2019 | 0 | — |
| +5 | K192961 | ADH19 | 3M Deutschland GmbH | 2019 | 2 | — |
| +5 | K181476 | Prime&Bond active Universal Adhesive | Dentsply Sirona | 2018 | 0 | — |
| +5 | K171226 | Tokuyama Universal Bond | Tokuyama Dental Corporation | 2017 | 1 | — |
| +5 | K172176 | Parkell Universal Adhesive | Parkell, Inc. | 2017 | 0 | — |
| +5 | K153231 | G-Cem LinkForce, Dual Cure Activator, Try-In Paste, Multi Primer | GC America, Inc. | 2016 | 5 | — |
| +5 | K133318 | Adhese Universal | Ivoclar Vivadent, AG | 2014 | 2 | — |
| +5 | K112118 | Dreambond | Bisco, Inc. | 2011 | 8 | — |
| +6 | K260682 | Bond-PR™ Universal Adhesive | Premier Dental Products Company | 2026 | 0 | — |
| +6 | K251946 | G aenial Universal Injectable II | GC America, Inc. | 2025 | 0 | — |
| +6 | K242097 | DenMat Bulk Fill Composite | Den-Mat Holdings, LLC | 2024 | 0 | — |
| +6 | K222830 | Rainbow 360 | Kerr Corporation | 2023 | 0 | — |
| +6 | K210804 | Adhese Universal DC, Cention Primer | Ivoclar Vivadent, AG | 2022 | 1 | — |
| +6 | K203760 | Tokuyama Universal Bond II | Tokuyama Dental Corporation | 2021 | 0 | — |
| +6 | K200798 | G-Cem One | GC America, Inc. | 2020 | 3 | — |
| +6 | K201787 | Light Cure Dental Adhesive | Rizhao Huge Biomaterials Company, Ltd. | 2020 | 0 | — |
| +6 | K161051 | All-Bond Universal w/BAC (not finalized) | Bisco, Inc. | 2016 | 6 | — |
| +7 | K261840 | BracePaste Prime Plus | American Orthodontics | 2026 | 0 | — |
| +7 | K254109 | G-Cem Universal | GC America, Inc. | 2026 | 0 | — |
| +7 | K252450 | Adhese 2 | Ivoclar Vivadent, Inc. | 2026 | 0 | — |
| +7 | K254063 | iCEM Universal Plus | Kulzer, LLC | 2025 | 0 | — |
| +7 | K242366 | OverCEM SA Universal; OverCEM SA Translucent; OverCEM SA Opaque; OverCEM Ti-Abutment… | Overfibers S.R.L. | 2025 | 0 | — |
| +7 | K230465 | Hi-Bond Universal | Mediclus Co., Ltd. | 2023 | 2 | — |
| +7 | K213401 | DIAPLUS Universal | DiaDent Group International | 2022 | 1 | — |
| +8 | K240743 | Peak Universal Bond | Ultradent Products, Inc. | 2024 | 1 | — |
| +8 | K220804 | Dia-X Bond Universal | DiaDent Group International | 2022 | 0 | — |
| +9 | K262252 | MPa Max adhesive | Den-Mat Holdings, LLC | 2026 | 0 | — |