Devices descending from K063557
12 later devices reach Peak Bond, Model 5133 through their predicates, nearest generation first.
| Generation | Number | Device | Applicant | Decided | Own descendants | Recalls |
|---|---|---|---|---|---|---|
| +1 | K100752 | Peak Universal Bond (Light Cure Resin Adhesive and Chlorhexidine) | Ultradent Products, Inc. | 2010 | 7 | — |
| +1 | K081913 | Metacem, Meta P&Bond, Metacem Silane Ceramic Primer | Meta Biomed Co., Ltd. | 2008 | 3 | — |
| +2 | K262252 | MPa Max adhesive | Den-Mat Holdings, LLC | 2026 | 0 | — |
| +2 | K240743 | Peak Universal Bond | Ultradent Products, Inc. | 2024 | 1 | — |
| +2 | K180802 | Meta P&Bond | Meta Biomed Co., Ltd. | 2018 | 0 | — |
| +2 | K171449 | Metacem | Meta Biomed Co., Ltd. | 2018 | 1 | — |
| +2 | K161051 | All-Bond Universal w/BAC (not finalized) | Bisco, Inc. | 2016 | 6 | — |
| +3 | K261166 | Dia-Cem | DiaDent Group International | 2026 | 0 | — |
| +3 | K261840 | BracePaste Prime Plus | American Orthodontics | 2026 | 0 | — |
| +3 | K230465 | Hi-Bond Universal | Mediclus Co., Ltd. | 2023 | 2 | — |
| +3 | K213401 | DIAPLUS Universal | DiaDent Group International | 2022 | 1 | — |
| +4 | K220804 | Dia-X Bond Universal | DiaDent Group International | 2022 | 0 | — |